Event Overview:
Date: August 28, 2025
Venue: Venue 4, Hall 11, Shenzhen World Exhibition & Convention Center
Scale: Over 200 participants from fields including embedded systems, AI, AIoT, healthcare, and more.
Attendees: Global institutions, industry leaders, experts, and innovative enterprises.
Event Value:
Focuses on the integration of cutting-edge embedded systems and AI technologies for innovative services.
Explores intelligent applications and scenarios of embedded technologies under the backdrop of smart transformation.
Provides a high-level, cross-industry dialogue platform and industry interaction network.
Shares multi-industry application cases and in-depth market trend analysis to support strategic decision-making.
Collaborates with four exhibitions (“AIGC, IOTE, EMBEDDED, Commercial Displays”) to empower industry development.
Conference Highlights:
Technical Focus: Edge AI, embedded AI, computer vision, AIoT, heterogeneous integration, multi-model algorithms, lightweight deployment, and ecological synergy.
Key Discussions:
Leveraging core features of embedded systems (dedication, real-time performance, low power consumption) to drive industry intelligence and efficiency.
Full industrial chain coverage: chips, modules, sensors, communication, edge AI, and embedded systems for collaborative innovation.
Scenario-based solutions: industrial automation, automotive, transportation, healthcare, smart displays, IoT, and more.
Hot Topics:
Deep integration of AI and edge computing.
Low-power chip design and sustainable development.
IoT and 5G expansion, multi-mode communication, and protocol compatibility.
Soft-hardware synergy: from virtualized edge computing to modular industrial PCs.
Open-source ecosystems, cloud-native platforms, computational efficiency, real-time security.
SOC systems, operating systems, tools, software, and information security.
Applications in smart manufacturing, intelligent transportation, energy management, healthcare, smart homes, and automotive systems.
Target Attendees:
Embedded system professionals (product managers, R&D, senior executives).
Government agencies, research institutes, academia, investors.
Industrial users from manufacturing, healthcare, transportation, energy, and more.
System integrators, hardware manufacturers, and software developers.
Industry Domains:
Smart Manufacturing: Automation, robotics, logistics, vision inspection, equipment management.
Medical Devices: Imaging systems, surgical robots, portable devices, smart terminals.
Transportation: Rail signaling, in-vehicle systems, smart parking, surveillance.
Energy: Smart grids, renewable energy, battery management, charging infrastructure.
Security: Smart cities, video surveillance, edge computing gateways.
Home Appliances: Smart speakers, cameras, lighting, locks, and electronics.
Invited Participants:
Embedded Hardware Providers: Advantech, AAEON, ADLINK, etc.
Industrial Users: Hon Hai (Foxconn), Flex, Jabil, etc.
Chip/Module Firms: Intel, Arm, NXP, Huawei HiSilicon, etc.
Software/Development Tools: QNX, FreeRTOS, FlyRT, etc.
Industry Leaders: Mindray, Midea, Hisense, etc.
Forum Agenda:
Advisors: Gigi Yu Bing (Edge-Cloud Synergy Ecosystem)
Host: Paul Wu Yiyu (Industrial Control Brothers)
Agenda (Draft):
